Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device
US11615999B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2022 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Jul 22, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K5/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present application disclose a method for preparing an oriented heat conducting sheet, which includes the following steps: Step S1, preparing a fluid composition for the heat conducting sheet; Step S2, placing the fluid composition obtained in the step S1 in an orientation molding device, applying a circumferential high-speed shear force to the fluid composition layer by layer to enable thermal conducting fillers in the fluid composition to be oriented along a shear direction to form an oriented thin-layer composition, and collecting the thin-layer composition layer by layer in a die to form a continuous multi-layer aggregate; Step S3, heat curing the multi-layer aggregate to obtain an oriented composition block; and S4, slicing the oriented composition block along the direction perpendicular to an orienting direction of the oriented composition block to obtain an oriented heat conducting sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.