Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material
US11616000B2 · kind B2 · utility
0Cited by
5References
25Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 25, 2021 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Jun 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/60
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus are disclosed to provide electrical shielding for integrated circuit packages using a thermal interface material. An integrated circuit package includes a substrate including a ground plane layer and a solder mask; a semiconductor die attached to the substrate, the solder mask layer separating the semiconductor die from the ground plane layer; and a thermal interface material surrounding at least a portion of the semiconductor die, the thermal interface material electrically coupled to the ground plane layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.