Integrated circuit semiconductor device
US11616118B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2020 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Dec 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/482
Abstract
An integrated circuit semiconductor device includes a plurality of cylindrical structures separated from each other on a substrate; and a plurality of supporters having an opening region exposing side surfaces of the plurality of cylindrical structures, the plurality of supporters being in contact with the side surfaces of the plurality of cylindrical structures and supporting the plurality of cylindrical structures, wherein each of the plurality of supporters has both side surfaces having slopes and has a top width that is less than a bottom width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.