Method for manufacturing electronic device
US11616165B2 · kind B2 · utility
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20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2020 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Apr 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/032
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for manufacturing an electronic device. First, a plurality of light-emitting elements is provided on a first substrate. Then, at least one of the plurality of light-emitting elements is transferred from the first substrate to a second substrate by a transferring head. The transferring head includes an electrode and a cantilever supporting the electrode, and the cantilever includes a U-shaped portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.