Heat dissipation module, display assembly and display device
US11617286B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 5, 2020 |
| Grant date | Mar 28, 2023 |
| Priority date | — |
| Expiry date | Feb 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8794
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 106Ω-1010Ω.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.