Face shield manufacturing method and assembly
US11617403B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2020 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | May 15, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B15/0015
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A face shield manufacturing method includes, among other things, positioning a bumper layer between a headband layer and a shield layer. The method further includes securing the bumper layer, the shield layer, and headband layer to provide a multilayered structure, and cutting a face shield assembly from the multilayered structure. A face shield assembly includes, among other things, a bumper configured to be placed against a front of a head of a user, a shield secured to the bumper, a headband configured to be placed against a rear of the head of the user, and fasteners. Each of the fasteners binds an end portion of the headband to at least the bumper. The headband is folded over each fastener when the bumper is placed against the front of the head of the user and the headband is placed against a back of the head of the user.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.