Patent · US Active

Method and device for providing through-openings in a substrate and a substrate produced in said manner

US11618104B2 · kind B2 · utility

0Cited by

3References

25Claims

0Family size

Assignee

LPKF LASER & ELECTRONICS SE · DE

Inventors

Robin Alexander Krueger · Hannover, DE
Norbert Ambrosius · Kevelaer, DE
Roman Ostholt · Langenhagen, DE

Key dates

Filing date	Feb 24, 2020
Grant date	Apr 4, 2023
Priority date	—
Expiry date	Aug 12, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/49827
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A device for modifying a region of a substrate includes a laser radiation source for pulsed laser radiation. A transmissive medium having a higher intensity-dependent refraction index than air is arranged between a laser machining head and the substrate such that an individual pulse of the pulsed laser radiation from the laser machining head is deflected through the transmissive medium and across a thickness of the substrate from an original focal depth to a focal depth different from the original focal depth to modify the substrate along a beam axis of the laser radiation in a region of a recess or through-opening to be formed in the substrate without removing an amount of the substrate material necessary to form the recess or through-opening. A length between the focal depths is greater than and extends across the thickness of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.