Patent · US Active

Encapsulated fragile insulation materials

US11618235B2 · kind B2 · utility

0Cited by

0References

9Claims

0Family size

Assignee

Holcim Technology Ltd · CH

Inventors

Michael J. Hubbard · Anderson, US
Chunhua Yao · Carmel, US
John B. Letts · Carmel, US

Key dates

Filing date	Oct 10, 2019
Grant date	Apr 4, 2023
Priority date	—
Expiry date	Oct 10, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02B80/10
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A composite board comprising (i) a first foam region; (ii) at least one fragile insulating material; and (iii) a second foam region, where said second foam region is substantially devoid of hydrocarbons.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.