Patent · US Active

Method for separating substrates

US11618707B2 · kind B2 · utility

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17Claims

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Assignee

Schott AG · DE

Inventors

Fabian Wagner · Heubach, DE
Volker Plapper · Alzey, DE
Andreas Ortner · Gau-Algesheim, DE
Simon Schmitt · Wiesbaden, DE
Frank-Thomas Lentes · Bingen, DE
Albrecht Seidl · Niedernberg, DE
Antal Makacs · Großschwabhausen, DE
Patrick BARTHOLOME · Jena, DE

Key dates

Filing date	Jul 2, 2019
Grant date	Apr 4, 2023
Priority date	—
Expiry date	Oct 19, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P40/57
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for separating a substrate of a brittle-hard material is provided. The method includes the steps of introducing defects into the substrate at a spacing from one another along a separation line using at least one pulsed laser beam; selecting an average spacing between neighboring defects and a number of laser pulses for generating a respective defect such that a breaking stress (σB) for separating the substrate along the separation line is smaller than a first reference stress (σR1) of the substrate and such that an edge strength σK of the separation edge obtained after separation is greater than a second reference stress (σR2) of the substrate; and separating the substrate after introducing the defects by applying a stress along the separation line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.