Wall compounds and methods of use
US11618712B2 · kind B2 · utility
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20References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2022 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Feb 15, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A wall compound for use in all applications and particularly well-suited for joining adjacent wallboards. The compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit at least one of yield stress and pseudoplastic-type behavior. In some embodiments, the compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the wall compound includes one or more associative thickeners.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.