Film with void spaces bonded through catalysis and method of producing the same
US11618807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 25, 2015 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Dec 25, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2483/04
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A film is provided with void spaces having a porous structure with less cracks and a high proportion of void space as well as having strength. The film with void spaces includes one kind or two or more kinds of structural units that form a structure with minute void spaces, wherein the structural units are chemically bonded through catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The film with void spaces can be produced by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.