Cleaning formulation for removing residues on surfaces
US11618867B2 · kind B2 · utility
0Cited by
36References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2022 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Nov 2, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure relates to a cleaning composition that contains 1) hydroxylamine; 2) a chelating agent; 3) an alkylene glycol; and 4) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.