Illumination assembly including thermal energy management
US11619376B2 · kind B2 · utility
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27References
4Claims
0Family size
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Key dates
| Filing date | Feb 11, 2022 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Feb 11, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.