Semiconductor module
US11621216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2018 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Aug 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/182
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a semiconductor switching element, a multiple of bases, on at least one of which the semiconductor switching element is mounted, a molded resin that seals the semiconductor switching element and the multiple of bases, a multiple of terminals formed integrally with each one of the multiple of bases and provided extending from an outer periphery side face of the molded resin, and a recessed portion or a protruding portion having a depth or a height such that creepage distance between the multiple of terminals is secured, and formed so as to cross an interval between the multiple of terminals, in one portion of the outer periphery side face of the molded resin between the multiple of terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.