Semiconductor device structure with magnetic element covered by polymer material
US11621317B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2021 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Oct 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.