Mounting structure for mounting micro LED
US11621381B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2019 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Jan 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/0753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micro-LED mounting structure includes a first layer having a conductive pad disposed on a surface thereof, a second layer including a first surface, a second surface opposite the first surface and disposed on the surface of the first layer, and a via-hole extending from the conductive pad of the first layer to the first surface and including a conductive material, and a micro-LED disposed on the first surface of the second layer to be electrically connected with the conductive material included in the via-hole. The via-hole includes a first opening in the first surface of the second layer and in which the conductive material is formed, the conductive material of the first surface provides a conductive area on a portion of the first surface of the second layer, and the conductive area and an area within a specified area of the conductive area define a substantially flat surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.