Systems and methods for solder paste printing on components
US11622451B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2021 |
| Grant date | Apr 4, 2023 |
| Priority date | — |
| Expiry date | Jan 4, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.