Methods for thermal forming an object
US11623368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Aug 3, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29B2013/027
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods for thermal forming an object are provided. In some embodiments, a method includes reading a mold identifier located on or in a mold, and determining mold process information from the mold identifier, the mold process information including heating information. The method can include heating a thermoformable material according to the heating information by adjusting power of one or more independently controllable heat sources. The method can also include monitoring one or more temperatures from a plurality of temperature sensing elements operably coupled to different areas of the thermoformable material. The thermoformable material can be heated according to the heating information and in response to the one or more monitored temperatures such that each of the different areas of the thermoformable material reach a respective desired temperature. The method can further include disposing the heated thermoformable material over at least a portion of the mold to form the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.