Patent · US Active

Interposer substrate, MEMS device and corresponding manufacturing method

US11623860B2 · kind B2 · utility

0Cited by

1References

13Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Corinna Koepernik · Reutlingen, DE
Joerg Muchow · Reutlingen, DE
Rainer Straub · Entringen, DE
Stefan Mark · Würzburg, DE

Key dates

Filing date	Nov 30, 2018
Grant date	Apr 11, 2023
Priority date	—
Expiry date	Jan 7, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2203/0384
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

An interposer substrate, a MEMS device and a corresponding manufacturing method. The interposer substrate is equipped with a front side and a rear side, a cavity starting from the rear side, which extends up to a first depth, a through-opening and a sunken area situated between the cavity and the through-opening, which is sunken from the rear side up to a second depth in relation to the rear side, the first depth being greater than the second depth.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.