Polyphenylene sulfide resin composition, method of preparing polyphenylene sulfide resin composition, and injection-molded article manufactured using polyphenylene sulfide resin composition
US11623988B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2019 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Dec 11, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2248
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.