Epoxy adhesive resistant to open bead humidity exposure
US11624012B2 · kind B2 · utility
0Cited by
12References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 4, 2017 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | May 25, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/53
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.