Method for producing a camera module
US11624890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2022 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | May 13, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for joining a camera module, which includes a base plate on which an image sensor is situated, and an objective holder in which an objective of the camera module is accommodated. The base plate and the objective holder are aligned relative to each other in a connection region and a connecting pin is guided through a recess of the base plate and/or the objective holder so that the connecting pin protrudes on the outside, and the at least one free end of the connecting pin is widened by a forming die using a radially acting deformation force such that the base plate and the objective holder are pressed against each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.