Fingerprint sensing apparatus
US11625943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2021 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Nov 4, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1318
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensing apparatus including a first substrate, a light sensing structure, a second substrate, a lens layer, a filler, and a first light shielding layer is provided. The light sensing structure is disposed on a sensing area of the first substrate. The lens layer is disposed on the second substrate. The lens layer has multiple first convex portions and a first concave portion. The filler is disposed between the lens layer and the light sensing structure. The refractive index of the filler is greater than the refractive index of the lens layer. The first light shielding layer is disposed between the second substrate and the lens layer. A solid of the first light shielding layer overlaps the first convex portions of the lens layer. An opening of the first light shielding layer overlaps the first concave portion of the lens layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.