Laminated alumina board for electronic device, electronic device, and chip resistor
US11626218B2 · kind B2 · utility
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4Claims
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Key dates
| Filing date | Jun 22, 2021 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Jun 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.