Custom photolithography masking via precision dispense process
US11626286B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2020 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Jul 17, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Systems and methods for custom photolithography masking via a precision dispense apparatus and process are disclosed. Methods include creating a toolpath instruction for depositing opaque onto a substrate, programming a precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit opaque material onto the substrate to form the photomask. The substrate may be an optically transparent plate or film or may be an electronic substrate where the opaque material is deposited directly onto a photoresist coating. Capabilities of the systems and methods disclosed herein extend to 3D substrates and custom photolithography masking, among others.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.