Wearable audio device with modular component attachment
US11627400B2 · kind B2 · utility
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1References
25Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 16, 2020 |
| Grant date | Apr 11, 2023 |
| Priority date | — |
| Expiry date | Jan 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/01
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various aspects include wearable audio devices enabling modular component attachment and detachment. In certain implementations, a wearable audio device includes: a headband for contacting a head of a user; an earpiece coupled with the headband for positioning proximate an ear of the user, the earpiece having an electro-acoustic transducer configured to output audio signals; and a slot configured to engage an electronic component, where the slot includes one or more snap-fit and/or friction-fit connectors for selectively engaging the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.