Joining method
US11628514B2 · kind B2 · utility
0Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2020 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | May 5, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of joining a first component to a second component at respective connection surfaces, comprising, in order, applying a local surface treatment to the connection surface of at least one of the first and second components in order to locally alter the microstructure to a depth of between 60 μm and 10 mm below the connection surface; and joining the first component to the second component using a welding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.