Housing structure and terminal device
US11630494B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2019 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Apr 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20981
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of this application disclose a housing structure and a terminal device. The housing structure includes a bottom shell and a lifting shell. A first end of the bottom shell is connected to a first end of the lifting shell, a second end of the bottom shell and a second end of the lifting shell are spaced by a first distance, and space between the bottom shell and the lifting shell forms a heat dissipation channel. A heat dissipation panel is disposed on the bottom shell, a first surface of the heat dissipation panel is in contact with a heat emitting component, and a second surface of the heat dissipation panel is located in the heat dissipation channel. Therefore, the housing structure provided in the embodiments of this application can better dissipate heat for the heat emitting component in the bottom shell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.