Monolithically integrated system on chip for silicon photonics
US11630799B2 · kind B2 · utility
11Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2022 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | May 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L27/34
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A hybrid electrical and optic system-on-chip (SOC) device configured for both electrical and optic communication includes a substrate, an electrical device configured for electrical communication arranged on the substrate, a photonics device configured for optic communication arranged on the substrate, and a self-test module arranged on the substrate. The self-test module is configured to receive a loop-back signal indicative of an optical signal output from the photonics device and calibrate the photonics device based on the loop-back signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.