Patent · US Active

Lending products with different repayment mechanisms

US11631128B1 · kind B1 · utility

0Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 2, 2020
Grant dateApr 18, 2023
Priority date
Expiry dateJul 2, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06Q40/03
  • WIPO fieldIT methods for management
  • WIPO sectorElectrical engineering

Abstract

Techniques described herein are directed to lending products with different repayment mechanisms. In an example, indication(s) of purchase(s) made using a payment instrument associated with a first lending product can be associated with a first data structure, wherein the first data structure is associated with a balance determined based at least in part on the indication(s). Based at least in part on determining that the balance exceeds a predetermined threshold, a portion of the balance can be associated with a second data structure associated with a second lending product, wherein the first lending product and the second lending product are independently associated with different repayment mechanisms. The portion of the balance can therefore be repaid via a repayment mechanism associated with the second lending product.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.