High-frequency line connection structure
US11631506B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2019 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Apr 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P3/081
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high-frequency line connection structure connects a coaxial line and a planar line. The high-frequency line connection structure includes a conductive base that is formed into a planar shape having a length that matches a length of the planar line along a lengthwise direction of a substrate, where the planar line is disposed on a surface of the conductive base, and a protrusion structure provided in a region, on the surface of the conductive base, adjacent to the coaxial line, the protrusion structure protruding from the surface of the conductive base, where the protrusion structure is in contact with a side surface of a region along the lengthwise direction of the substrate, where a ground conductive film with a smaller width out of a pair of ground conductive films of the planar line, is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.