Integration of bypass diodes within thin film photovoltaic module interconnects
US11631777B2 · kind B2 · utility
1Cited by
3References
15Claims
0Family size
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Key dates
| Filing date | Mar 11, 2019 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Mar 11, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
Abstract
Thin-film solar cell modules and serial cell-to-cell interconnect structures and methods of fabrication are described. In an embodiment, a solar cell interconnect includes a bypass diode between adjacent solar cells to allow the flow of current around a single solar cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.