Packaged white light emitting devices comprising photoluminescence layered structure
US11631792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2021 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Jul 19, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A light emitting device includes a Chip Scale Packaged (CSP) LED, the CSP LED including an LED chip that generates blue excitation light; and a photoluminescence layer that covers a light emitting face of the LED chip, wherein the photoluminescence layer comprises from 75 wt % to 100 wt % of a manganese-activated fluoride photoluminescence material of the total photoluminescence material content of the layer. The device/CSP LED can further include a further photoluminescence layer that covers the first photoluminescence and that includes a photoluminescence material that generates light with a peak emission wavelength from 500 nm to 650 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.