Method of bonding acid-doped membranes and a bonded polybenzimidazole membrane structure
US11631877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2019 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Mar 2, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for bonding together two or more acid-doped polybenzimidazole films is provided. The method includes, in the following order: placing a first acid-doped polybenzimidazole film on a first substrate to form a first film/substrate assembly and placing a second acid-doped polybenzimidazole film on a second substrate to form a second film/substrate assembly; heating the first and second film/substrate assemblies to a temperature sufficient to soften the first and second acid-doped polybenzimidazole films; positioning the second film/substrate assembly atop the first film/substrate assembly, such that polybenzimidazole polymer chains of the first acid-doped polybenzimidazole film interact with polybenzimidazole polymer chains of the second acid-doped polybenzimidazole film; and re-hydrolyzing the first and second acid-doped polybenzimidazole films, such that the polybenzimidazole polymer chains of the first and second acid-doped polybenzimidazole films are therefore reformed and interlocked with each other to bond together the first and second acid-doped polybenzimidazole films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.