Control device and motor device that ensure heat dissipation while reducing the size of the motor device
US11632013B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | May 1, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M1/327
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A control device includes a first substrate provided with a chip electronic component; a second substrate having a surface provided with electronic components including a tall component taller than the chip electronic component, the surface of the second substrate facing a surface of the first substrate that is provided with the chip electronic component; and a heat sink disposed between the first substrate and the second substrate. The heat sink includes a component receiving portion and a heat dissipation portion, the component receiving portion being configured to receive the tall component, the heat dissipation portion being configured to perform heat exchange between the first substrate and the second substrate, and the component receiving portion and the heat dissipation portion being provided so as not to overlap with each other as viewed in a facing direction in which the first substrate and the second substrate face each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.