Wafer level surface acoustic wave filter and package method
US11632095B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2021 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Dec 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/6423
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present application provide a wafer level surface acoustic wave filter and a package method, the surface acoustic wave filter includes a wafer, an electrode layer, a supporting wall and a cover plate; wherein, the wafer includes a substrate layer and a piezoelectric thin film layer combined together by wafer bonding, the electrode layer is arranged on a surface of the piezoelectric thin film layer, the supporting wall surrounds between the piezoelectric thin film layer and the cover plate to form a sealed cavity; and the cover plate includes at least a first material layer, which uses the same material as the substrate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.