Earphone module
US11632618B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 10, 2022 |
| Grant date | Apr 18, 2023 |
| Priority date | — |
| Expiry date | Feb 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2420/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An earphone module, including a housing, a circuit board, a feeding conductor, a first grounding conductor, and a second grounding conductor, is provided. The housing includes an insulating housing and a metal ring connected thereto. The metal ring serves as an antenna and includes a feeding end, a first ground end, a second ground end, and a slit that splits the metal ring. The slit is located between the feeding end and the first ground end. The second ground end is located between the feeding end and the slit. The circuit board is located in the insulating housing. A slot is formed between the circuit board and the metal ring. The feeding conductor is connected to the feeding end and the circuit board. The first grounding conductor is connected to the first ground end and the circuit board. The second grounding conductor is connected to the second ground end and the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.