Feedthrough assembly and device including same

US11633611B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• Andrew J. Ries · Lino Lakes, US
• Chunho Kim · Phoenix, US
• Robert A. Munoz · Andover, US
• Christopher T. Kinsey · Gilbert, US
• Jeffrey S. Voss · White Bear Lake, US
• Kris A. Peterson · Minneapolis, US
• Mark E. Henschel · Phoenix, US

Key dates

• Filing date: Dec 17, 2020
• Grant date: Apr 25, 2023
• Expiry date: Jun 11, 2041

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61N1/3756
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.