Solder paste on demand apparatus
US11633702B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2022 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Jul 1, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F9/04
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A system and method are presented for producing solder paste having undercooled metallic core-shell particles. In one or more arrangements, the system includes a reconstitution assembly, a dispenser assembly, and a mixer, among other components. The reconstitution assembly is configured to place the cores of the solid core metallic core-shell particles into an undercooled liquid state to form a plurality of undercooled metallic core-shell particles. The dispenser assembly is configured to dispense one or more of a set of available flux components. The mixer assembly is configured to mix the one or more of the set of flux components dispensed by the dispenser assembly with the plurality of undercooled metallic core-shell particles formed by the reconstitution assembly to form a solder paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.