Method for repairing polishing pad in real time
US11633834B2 · kind B2 · utility
0Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2020 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Jun 5, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for repairing a polishing pad in real time includes a trimming step, a detection step, and a reconstruction and analysis step. A surface morphology of the polishing pad is reconstructed through detection, and analysis is performed according to the reconstruction, to ensure that a surface of the polishing pad can recover its function after the surface of the polishing pad is trimmed, so that the polishing pad can be used effectively to reduce costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.