Methods and systems for thermal forming an object
US11633877B2 · kind B2 · utility
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198References
17Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 11, 2019 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Dec 11, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29B2013/027
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and system for thermal forming an object. A mold is provided, a shape of which corresponds to a desired shape of the object. A material is inserted into a heating area, and the material is heated using a plurality of independently controllable heat sources that heat different areas of the material. The heated material is then disposed over or into at least a portion of the mold so as to deform the material. The deformed material may then be trimmed so as to form the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.