Patent · US Active

Fabrication method of hexagonal boron nitride (h-BN)-based thermally-conductive composite film

US11633946B2 · kind B2 · utility

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Key dates

Filing dateJun 11, 2022
Grant dateApr 25, 2023
Priority date
Expiry dateJun 11, 2042

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2307/748
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A fabrication method of a hexagonal boron nitride (h-BN)-based thermally-conductive composite film includes the following steps: S1. attaching an adhesive layer to an h-BN film carried on a carrier film, and separating the h-BN film from the carrier film to obtain a film in which an adhesive layer side is defined as a side A and an h-BN film side is defined as a side B; S2. attaching an adhesive layer to the side B of the film obtained in S1; S3. pasting a high-power graphite film to the side B of a film obtained in S2; S4. attaching an adhesive layer to the side B of a film obtained in S3; and S5. shaping a film obtained in S4 according to a required size. The present fabrication method is conducive to improving the production efficiency or yield rate of a thermally-conductive film product and the product quality.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.