Composite spring for robust piezoelectric sensing
US11634317B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2019 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Sep 25, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0163
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micro-electromechanical system (MEMS) device comprises a fixed portion and a proofmass suspended by at least one composite beam. The composite beam is cantilevered relative to the fixed portion and extends between a first end that is integrally formed with the fixed portion and a second distal end. The composite beam comprises an insulator having a top surface and at least two side surfaces; a conductor extending away from the fixed portion and surrounding at least a portion of the insulator; and a second conductor positioned adjacent to the top surface of the conductor and extending parallel with the insulator away from the fixed portion. The second conductor is separated from the first conductor to provide a low parasitic conductance of the composite beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.