Nonconductive, modular barrier assemblies and related methods
US11634927B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2020 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Apr 23, 2040 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04H17/23
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
The present invention provides a modular, nonconductive barrier assembly for enclosing or partitioning an area. The modular, nonconductive barrier assembly includes a number of wall panels each having multiple nonconductive posts arranged in a common plane and separated by a gap. The nonconductive posts are connected by a number of connecting rods. Each wall panel is arranged in an upright orientation on a support surface. A number of support assemblies each having a base and at least one support arm support the wall panels in an upright orientation. The base of each support assembly is positioned on a support surface, a proximal end of the support arm is releasably connected to the base and a distal end of the support arm is releasably connected to a wall panel to support the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.