Endwall directional cooling
US11635000B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 23, 2021 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Dec 23, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2260/204
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
An endwall may be disposed at one end of a vane assembly. The endwall may comprise an endwall spar and a coversheet on the hot surface of the endwall spar. The endwall may further comprise a cooling fluid channel between the hot surface of the endwall spar and the cold surface of the coversheet. The cooling fluid channel may include a cooling fluid inlet disposed in the endwall spar, and a cooling fluid outlet. The cooling fluid outlet may be formed at an angle with the axis of the endwall spar. A plurality of pedestals may be disposed on the hot surface of the endwall spar extending into the cooling channel. The pedestals may be formed at an angle with the axis of the endwall spar to direct a cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.