Array substrate, manufacturing method thereof, and display apparatus

US11637166B2 · kind B2 · utility

Assignee

• BOE Technology Group Co., Ltd. · CN

Inventors

• Yingwei Liu · Beijing, CN
• Qi Yao · Nanhu, CN
• Ke Wang · Beijing, CN
• Zhanfeng Cao · Beijing, CN
• Zhiwei Liang · Beijing, CN
• Muxin Di · Beijing, CN
• Guangcai Yuan · Beijing, CN
• Xue Jiang · Beijing, CN
• Dongni Liu · Beijing, CN

Key dates

• Filing date: Nov 13, 2019
• Grant date: Apr 25, 2023
• Expiry date: Feb 27, 2041

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/549

Abstract

The present disclosure relates to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming a main via hole in a substrate, filling a first conductive material in the main via hole, and forming a pixel circuit layer on a first surface of the substrate. The pixel circuit layer may include a first via hole. An orthographic projection of the first via hole on the substrate may at least partially overlap the corresponding main via hole.