Method of manufacturing light emitting device
US11637217B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2020 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Sep 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a light emitting device is provided. The method includes providing a substrate, disposing a plurality of light emitting elements on the substrate, disposing an insulating layer on the plurality of light emitting elements, patterning the insulating layer to form a partition wall defining a plurality of cavities corresponding to the plurality of light emitting elements, filling a light conversion ink in at least a part of the cavities, and baking the light conversion ink, wherein the partition wall is configured to block the light conversion ink from overflowing in the step of filling the light conversion ink in at least the part of the cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.