Patent · US Active

Converter including an electrically isolating and thermally conductive layer

US11637504B1 · kind B1 · utility

1Cited by
0References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 31, 2022
Grant dateApr 25, 2023
Priority date
Expiry dateAug 31, 2042

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K1/0277
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A power electronics converter includes a carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes a power semiconductor switching element. The power semiconductor switching element is comprised in a power semiconductor prepackage. The power semiconductor prepackage includes a power semiconductor switching element embedded in a solid insulating material, and an electrical connection extending from a terminal of the power semiconductor switching element through the solid insulating material to an electrical connection side of the power semiconductor prepackage. The power electronics converter includes a heat sink arranged to remove heat from the power semiconductor prepackage. The power electronics converter includes a thermal interface layer arranged between the heat removal side of the power semiconductor prepackage and the heat sink. A thermal conductivity of the thermal interface layer divided by an electrical conductivity of the thermal interface layer is greater than or equal to 1 TW/SK.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.