Converter including an electrically isolating and thermally conductive layer
US11637504B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2022 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Aug 31, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0277
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power electronics converter includes a carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes a power semiconductor switching element. The power semiconductor switching element is comprised in a power semiconductor prepackage. The power semiconductor prepackage includes a power semiconductor switching element embedded in a solid insulating material, and an electrical connection extending from a terminal of the power semiconductor switching element through the solid insulating material to an electrical connection side of the power semiconductor prepackage. The power electronics converter includes a heat sink arranged to remove heat from the power semiconductor prepackage. The power electronics converter includes a thermal interface layer arranged between the heat removal side of the power semiconductor prepackage and the heat sink. A thermal conductivity of the thermal interface layer divided by an electrical conductivity of the thermal interface layer is greater than or equal to 1 TW/SK.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.