Low profile power module package
US11638359B2 · kind B2 · utility
0Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2021 |
| Grant date | Apr 25, 2023 |
| Priority date | — |
| Expiry date | Nov 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.