Sustainable sealed package and method for manufacturing thereof
US11639258B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2022 |
| Grant date | May 2, 2023 |
| Priority date | — |
| Expiry date | Jun 2, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W90/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sustainable sealed package includes a biofoam molded tray and a paperboard substrate. The biofoam molded tray includes a circumferential flange defining an opening to an interior cavity of the biofoam molded tray. A heat sealing layer is on a first major side of a paperboard substrate. The heat sealing layer is sealed to the circumferential flange of the biofoam molded tray.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.